In the current digital era, data traffic is experiencing explosive growth, especially in fields such as data centers, High-Performance Computing (HPC), and Artificial Intelligence (AI). To meet the demand for high-speed and large-capacity data transmission in these fields, optical communication technology continues to evolve. The OSFP 800G 100m optical module, leveraging its advantages of high bandwidth and high stability, has become a key technical solution and is widely used in various high-speed interconnection scenarios.
I. Technical Principles
1. Parallel Transmission Technology
The OSFP 800G 100m optical module typically adopts an 8×100G parallel channel design. This design allows the module to transmit data through 8 independent channels simultaneously, with each channel capable of a data rate of up to 100Gbps, thereby achieving an aggregated rate of 800Gbps. Parallel transmission not only increases data transmission speed but also effectively reduces the signal transmission pressure on a single channel, enhancing the stability and reliability of data transmission.
2. PAM4 Modulation Technology
To achieve a higher data transmission rate within limited bandwidth resources, this optical module adopts PAM4 (4-Level Pulse Amplitude Modulation) technology. Compared with the traditional NRZ (Non-Return-to-Zero) modulation method, PAM4 modulation technology can encode 2 bits of data in each symbol period, doubling the channel utilization rate. This enables efficient transmission of large volumes of data at a channel rate of 100Gbps, while reducing the requirement for fiber bandwidth to a certain extent and optimizing the overall transmission performance.
3. Composition of Optoelectronic Components
Transmitter Side: The transmitter side uses a Vertical-Cavity Surface-Emitting Laser (VCSEL) array. In 850nm short-distance transmission scenarios, the VCSEL array offers advantages such as low power consumption, easy integration, and excellent high-speed modulation performance.
Receiver Side: A PIN photodiode is employed. PIN diodes feature low cost and fast response, making them highly suitable for short-distance, high-speed reception scenarios of 800GBASE-SR8. They can convert optical signals into electrical signals, and restore the original data through amplification and demodulation.
II. Detailed Performance Parameters
1.Transmission Rate
This optical module has a high-speed transmission capability of 800Gbps, enabling it to meet application scenarios with extremely high bandwidth requirements, such as high-speed interconnection between core switches in data centers and data communication between GPU clusters. In distributed AI model training, a large amount of data needs to be transmitted quickly between various computing nodes. The 800Gbps transmission rate enables real-time data synchronization, significantly improving the efficiency of model training and ensuring the smooth progress of ultra-large-scale model training.
2. Transmission Distance
The transmission distance of this optical module is 100m, which is suitable for short-distance, high-speed data transmission scenarios such as interconnection between racks in data centers and between different cabinets in the same equipment room. In the typical architecture of data centers, the distance between leaf switches and spine switches under the leaf-spine network architecture is usually within 100m. The OSFP 800G 100m optical module can well meet this short-distance, high-bandwidth connection requirement.
3. Power Consumption
With the increase in data transmission rate, the power consumption of optical modules has become an increasingly prominent issue. At the high rate of 800Gbps, optimizing the power consumption of OSFP optical modules is crucial. Currently, 800G OSFP 100m optical modules reduce energy consumption through the adoption of low-power chip designs, efficient power management technologies, and optimized circuit layouts.
4. Heat Dissipation
Optical modules generate heat during operation; if the heat cannot be dissipated, problems are likely to occur. Fortunately, OSFP modules are equipped with heat sinks on the top, or use methods such as fan cooling and liquid cooling. Especially in areas with dense servers, liquid cooling can quickly remove heat, ensuring the stable operation of the optical module in high-temperature environments and effectively avoiding issues such as performance degradation, data transmission errors, and even equipment failures caused by overheating.
III. Application Scenarios
1. Internal Interconnection of Data Centers
Interconnection of Core Switches: With the expansion of data center scale and the growth of business demands, core switches require high-speed and large-capacity interconnection. The OSFP 800G 100m optical module provides an 800Gbps link, improving the bandwidth and transmission efficiency of data centers and meeting the needs of large-scale data exchange and processing.
Leaf-Spine Network Architecture: As the mainstream architecture of modern data centers, leaf switches connect terminal devices, while spine switches aggregate traffic. This optical module is used for the uplink between leaf and spine switches, realizing 800G aggregation, increasing throughput, simplifying wiring, and enhancing network scalability and management efficiency.
Connection Between Servers and Switches: It is compatible with servers with high-speed interfaces such as GPU servers supporting 800Gbps rate. It gives full play to the computing performance of servers, ensures high-speed data transmission between servers and the network, and meets the needs of large-scale data reading and writing.
2. High-Performance Computing (HPC) Clusters
In HPC clusters frequent data exchange and sharing are required between various computing nodes. For example, in scientific computing fields such as weather simulation and molecular dynamics simulation, computing nodes need to transmit large amounts of simulation data in real time. The high-speed and low-latency characteristics of the OSFP 800G 100m optical module can meet the strict requirements for data transmission between nodes in HPC clusters, realizing efficient communication between computing nodes and improving the computing efficiency and performance of the entire cluster.
3. Artificial Intelligence (AI) Computing
GPU Cluster Communication: During AI model training, a large number of GPUs need to work collaboratively, resulting in massive data communication between GPUs. The OSFP 800G 100m optical module can provide high-speed and stable connections for GPU clusters, supporting RDMA (Remote Direct Memory Access) non-blocking communication between GPU nodes. It reduces network latency to the microsecond level, realizing fast data transmission and sharing between GPUs, greatly accelerating the AI model training process and shortening the training cycle.
AI Computing Power Deployment in Data Centers: With the wide application of AI technology in data centers, data centers need to provide strong computing power support for AI computing. By using the OSFP 800G 100m optical module to build a high-speed network, different AI computing resources (such as GPU servers and AI accelerators) can be efficiently connected to form a powerful AI computing power network, meeting the large-scale and high-performance computing needs of data centers for AI applications.
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